 |
2004 |
Started CPU testing (Testing、Burn-In、Laser
Trimming、Marking
、
Lead Inspection、Packing
、Drop Shipment、fuse
trimming) |
|
|
2002 |
QS-9000 Registered (Testing + Assembly)
|
|
|
2001 |
BVQI ISO14001 registered (Testing+ Assembly)
|
|
|
2000 |
Completed secondary public offerings |
|
|
1999 |
Flip Chip technology transferred |
|
|
1998 |
Started mass production for BGA package |
|
|
|
Passed HP's audit |
|
|
|
Started mass production for TSOPII package |
|
|
|
BVQI ISO9001 registered
|
|
|
1997 |
Listed in Taiwan OTC market |
|
|
|
Completed 100 millions DRAM tested units |
|
|
|
Added mixed signal IC, SDRAM testing
|
|
|
1996 |
Signing BGA transfer agreement with Citizen |
|
|
1995 |
BVQI ISO9002 registered
|
|
|
|
Obtained ISO9002 certificate |
|
|
|
Added SRAM, SSRAM testing
|
|
|
1992 |
Certified by TI as its qualified subcontractor |
|
|
|
Started memory IC testing |
|
|
1988 |
Company setup |
|
|
|
Engaged in logic IC testing |
